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Publication details

Document type
Conference papers

Document subtype
Full paper

Title
Room temperature spalling of silicon thin foils using a stress inducing epoxy layer

Participants in the publication
Bellanger P (Author)
Sousa P (Author)
Bouchard P-O (Author)
Bernacki M (Author)
Brito MC (Author)
Serra JM (Author)
Dep. Engenharia Geográfica, Geofísica e Energia
IDL

Date of Publication
2014

Event
29th EUPVSEC

Publication Identifiers
ISBN - 3936338345

Address
Amsterdam

Starting page
579
Last page
582

Document Identifiers
DOI - https://doi.org/10.4229/eupvsec20142014-2do.1.1


Export

APA
Bellanger P, Sousa P, Bouchard P-O, Bernacki M, Brito MC, Serra JM, (2014). Room temperature spalling of silicon thin foils using a stress inducing epoxy layer. 29th EUPVSEC, 579-582

IEEE
Bellanger P, Sousa P, Bouchard P-O, Bernacki M, Brito MC, Serra JM, "Room temperature spalling of silicon thin foils using a stress inducing epoxy layer" in 29th EUPVSEC, Amsterdam, 2014, pp. 579-582, doi: 10.4229/eupvsec20142014-2do.1.1

BIBTEX
@InProceedings{34739, author = {Bellanger P and Sousa P and Bouchard P-O and Bernacki M and Brito MC and Serra JM}, title = {Room temperature spalling of silicon thin foils using a stress inducing epoxy layer}, booktitle = {29th EUPVSEC}, year = 2014, pages = {579-582}, address = {Amsterdam}, publisher = {} }