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APA
E.J.R. Palin, K.S. Ryder, A.R. Hillman, E.L. Smith, Virginia C Ferreira, R. Sapstead, N.J. Steinke, R. Barker, R. Dalgliesh, (2017). A Novel Electrochemical Method for Analysis of Thin Metal Films and Bilayers for Application in the PCB Industry. Book of Abstracts, -
IEEE
E.J.R. Palin, K.S. Ryder, A.R. Hillman, E.L. Smith, Virginia C Ferreira, R. Sapstead, N.J. Steinke, R. Barker, R. Dalgliesh, "A Novel Electrochemical Method for Analysis of Thin Metal Films and Bilayers for Application in the PCB Industry" in Book of Abstracts, , 2017, pp. -,
doi:
BIBTEX
@InProceedings{41770,
author = {E.J.R. Palin and K.S. Ryder and A.R. Hillman and E.L. Smith and Virginia C Ferreira and R. Sapstead and N.J. Steinke and R. Barker and R. Dalgliesh},
title = {A Novel Electrochemical Method for Analysis of Thin Metal Films and Bilayers for Application in the PCB Industry},
booktitle = {Book of Abstracts},
year = 2017,
pages = {-},
address = {},
publisher = {}
}